To My Readers



If this is the first time you're visiting my blog, thank you. Whether you're interested or just curious to find out about PCB reverse engineering (PCB-RE), I hope you'll find something useful here.

This blog contains many snippets of the content in my books to provide a more detailed overall sampling for my would-be readers to be better informed before making the purchase. Of course, the book contains more photos and nice illustrations, as evidence from its cover page. Hopefully, this online trailer version will whet your appetite enough to want to get a copy for yourself.

Top Review

I started doing component level repair of electronics with (and without) schematics more than 40 years ago, which activity often involves reverse-engineering of printed circuit boards. Although over the years my technical interests have shifted into particle beam instrumentation, electron microscopy, and focused ion beam technology fields, till this day——and more often than not——PCB repairs have returned multiple multi-million-dollar accelerators, FIB, and SEM instruments back to operation, delivering great satisfaction and some profit.

Many of the methods described by Keng Tiong in great details are similar to the approaches I've developed, but some of the techniques are different, and as effective and useful as efficient and practical. Systematic approach and collection of useful information presented in his books are not only invaluable for a novice approaching PCB-level reverse engineering, but also very interesting reading and hands-on reference for professionals.

Focus on reverse engineering instead of original design provides unique perspective into workings of electronics, and in my opinion books by Keng Tiong (I've got all three of them) are must-read for anybody trying to develop good understanding of electronics——together with writings by Paul Horowitz and Winfield Hill, Phil Hobbs, Jim Williams, Bob Pease, Howard Johnson and Martin Graham, Sam Goldwasser, and other world's top electronics experts.

Valery Ray
Particle Beam Systems Technologist

Saturday, December 14, 2019

Packaging Challenges

You might be surprised to know that electronics packaging predates the printed circuit board. Over the past 60 years, packages have continued to shrink in footprints yet increase in functionalities. Some packages are no bigger than the period at the end of this sentence.Today, there are more types of packages than ever before that can be found mounted on a given PCB. The ever expanding package acroniums is proof of this phenomenon: QFN, QFP, SOT, TSSOP, PDIP, WLCSP, BGA, FPBGA, SOIC, PoP, COF, WLP, FOWLP, and many more.

COF and WLP Packaging

This increasing trend in PCB design also presents challenges to PCB reverse engineering, especially for newbies and occasional apprentices. Identifying these components is one thing; finding related information and datasheets is another; yet still to overcome is the accessibility of probe points since most of these use BGA footprints with high-density pin-counts to reduce PCB real estate. It's a literal nightmare for manual PCB-RE work.

So unless you have the resources to do it, my advice is to steer clear of them unless it's a do-or-die mission. Remember, you have been warned.

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